Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...
Understanding the thermal performance of integrated circuits, whether they are microcontrollers, FPGAs, or processors, has always been essential to avoid the overheating that can cause circuit ...
The trend in end-equipment design is to optimize the module profile for sizing. This introduces a migration from metal heat sinks to PCB copper plane-based thermal management. Today’s modules use ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (NASDAQ: CDNS) today expanded its presence in the system analysis and design market with the introduction of the Cadence ® Celsius ™ ...
The electronics industry exists in a continuous state of evolution. The world’s biggest companies are either launching new products, or refining and improving existing ones. In keeping with consumer ...
December 12, 2011. Mentor Graphics Corp. has announced what it calls the electronic industry’s first combined technology for thermal characterization and simulation with T3Ster® hardware test products ...
is the thermal resistance between the object and the environment. The problem is to determine whether the integrated circuit in question is reliable at high temperatures. Without a particular method ...
While marketers strive to launch the next “hot” product, engineers struggle to prevent literally hot products! A recent breakthrough in thermal modeling comes just in time as electronic component ...
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